The go-to method in order to increase the CPU performance has always been overclocking. One of the biggest issues of high clock rate is temperature. Those users who want the highest clock speeds have always loved soldered integrated heat spreaders, they are the next best thing when it comes to cooling. Intel may finally be bringing back the soldered IHS for the upcoming 9th Gen Core CPUs.
Intel made the controversial choice for the Ivy Bridge by using thermal paste instead of solder IHS, back in 2012. As expected, as the temperatures raised the stock overclocking started to suffer. Those users who wanted the best clock speeds and best temperatures resorted to warranty voiding delidding. Intel claimed that the thermal paste was necessary due to the smaller die size. Some of the observers suggested that it’s a penny-pinching way to save on solder IHS. There were not many reasons for Intel to do better, due to a weaker AMD.
Now, Intel is pulling out all the stops because AMD has revived with Ryzen. Intel is returning to the use of solder IHS, once again. This will hopefully improve both stock performance as temperatures remain low and overclock speeds as well. Apart from Intel’s previous protestations, it doesn’t seem like that there will be any disadvantages of using a solder IHS. Even though delidding is near impossible, it won’t be needed anymore. The real question is that how many of the processors from the lineup will get the solder IHS or only the top end 8 core chips.
The leaked slides also have some details about the specifications of the processors. The Core i5-9600K will be featuring 6 cores at a 3.7GHz base and 4.6GHz boost. The Core i7-9700K will be featuring 8 cores at a 3.6GHz base and 4.9GHz boost. The Core i9-9900K will be featuring 8 cores with the addition of Hyper-Threading and with the boost set to 5.0GHz. We are seeing Intel release more interesting and compelling chips as AMD is pushing too.
Stay tuned for more!